Sony has shared that it will be sharing two new sensors at the upcoming 2019 International Electronic Devices Meeting (IEDM) in San Francisco. The new sensor may signal a new wave of photography technology and method coming our way.

The company will actually present various sensors at the meeting, but two stands out in the pack – a quad-bayer 1/2-inch 48MP “All-PDAF” CMOS chip and an organic “Three-layer Stacked Color Image Sensor.”

For the first sensor, Sony says that the chip will be the ‘World’s First’ sensor to be both quad-bayer construction and have PDAF tech built in, designed for high-resolution capture and HDR, along with the AF working as low as 1 lux.

We created the world’s first all PDAF CMOS image sensor using 2×2 on-chip lens architecture. That had 1/2 inch 48M pixels with 0.8µm Quad Bayer coding for high resolution and HDR function, and all PDAF pixels achieved a minimum AF illuminance level of 1 lux.

Sony Semiconductor Solutions Corporation

Meanwhile the organic sensor can help with false colour problems when taking photo thanks to the triple stacked layer of colour filters – one each for red, blue and green.

The two sensors may head to APSC, MFT and Full Frame sensors as early as next year, so we should be seeing some news coming out from CP+ 2020 in Yokohama, one of the biggest photography events in Japan. This news is great for photographers out there, looking to get more out of their images in the field.